This work was supported by the National Key Research and Development Program of China (No. 2020YFE0202002) and the National Natural Science Foundation of China (Nos. 11875146 and U1932143).
机构署名：
本校为第一且通讯机构
院系归属：
物理科学与技术学院
摘要：
Topmetal-M2 is a large-area pixel sensor chip fabricated using the GSMC 130nm\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$130\,\textrm{nm}$$\end{document} CMOS process in 2021. The pixel array of Topmetal-M2 consists of pixels of 400 rows x\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgree...
摘要(中文)：
Topmetal-M2 is a large-area pixel sensor chip fabricated using the GSMC 130 nm CMOS process in 2021.The pixel ...展开更多 Topmetal-M2 is a large-area pixel sensor chip fabricated using the GSMC 130 nm CMOS process in 2021.The pixel array of Topmetal-M2 consists of pixels of 400 rows×512 columns with a pixel pitch of 45μm×45μm.The array is divided into 16 subarrays,with pixels of 400 rows×32 columns per subarray.Each pixel incorporates two charge sensors:a diode sensor and a Topmetal sensor.The in-pixel circuit primarily consists of a charg...
